Analysis of Fatigue Life of Electronic Package under Thermal Cycling Condition by Acceleration Model  
Author Yao Hsu


Co-Author(s) Wen-Fang Wu; Yi-An Lu


Abstract Prediction on fatigue lives of electronic packages is always an issue to engineers. In general, prediction approaches can be divided into two categories. One is numerical such as the finite element method (FEM) and the other is experimental such as accelerated life testing (ALT). The FEM, used mainly by design engineers, aims to predict the fatigue life of a package by considering physical processes that lead to failure. On the other hand, ALT is usually carried out by testing engineers to correlate the product’s fatigue life under different environmental conditions through acceleration factors (AFs). The present study intends to adopt FEM as a substitute for ALT to predict fatigue lives of an electronic package under various thermal conditions. By considering the phenomena of scattered life data observed in real ALT, a probability design technique regarding material properties and geometric dimensions as random variables is employed. An FEM model of the plastic ball grid array (PBGA) is constructed and used for demonstration. The results show the analytical procedure proposed in this study has its efficiency and effectiveness.


Keywords Fatigue life, Electronic package, Acceleration model
    Article #:  21146
Proceedings of the 21st ISSAT International Conference on Reliability and Quality in Design
August 6-8, 2015 - Philadelphia, Pennsylvia, U.S.A.