Lifetime Estimation of Ceramic Package Light-Emitting Diodes using Complex-Stress and Real-Time Monitoring | ||||
Author | Byungjin Ma
|
|||
Co-Author(s) | Jemin Kim; Sungsun Choi; Kwanhoon Lee
|
|||
Abstract | A complex-stress accelerated lifetime test (ALT) model, based on the combination of a thermal stress and an optical stress, was proposed and verified experimentally in order to reduce a testing time and enhance an accuracy of the lifetime estimation of light emitting diode (LED) packages. For verifying the proposed model, we developed a special ALT system capable of an in-situ monitoring of electrical, optical and thermal characteristics. The transient response of a voltage change in the LED chips was used to monitor the junction temperature as a measure of thermal stress on the lifetime. And the lifetimes of LED packages could be estimated according to the junction temperature and the relative optical power through the proposed complex-stress ALT.
|
|||
Keywords | LED, lifetime, ceramic package, accelerated lifetime test, junction temperature, real-time monitoring | |||
Article #: 19211 |
August 5-7, 2013 - Honolulu, Hawaii, U.S.A. |