A Fuzzy Assessment and Improvement Decision-Making Model for IC Packaging Process Quality in Smart Manufacturing Environments  
Author Kuen-Suan Chen

 
Co-Author(s)

Chun-Min Yu;  Yen-Chun Huang

 
Abstract Taiwan is globally recognized as the top producer in semiconductor foundry and integrated circuits (ICs) packaging and testing output, forming a comprehensive electronics industry chain. IC components have a wide range of applications and are essential to information technology, network communications, consumer electronics, automotive systems, industrial equipment, and aerospace and defense products. This study proposed a fuzzy evaluation model to identify IC components that need improvements based on their operational performance indices. To maintain generality, it was assumed that a product contains m IC components. Failure in any of these would cause the product to cease functioning, requiring repairs and increasing economic costs and carbon emissions. The operational performance indices for IC components were established based on failure time intervals; however, as their parameters are undetermined, this study utilized sample data for estimation. Currently, enterprises prioritize rapid response mechanisms that can facilitate decision-making even under limited sample sizes. According to Chen et al. [1], when sample sizes are small, a confidence interval-based fuzzy hypothesis testing method can be used to enhance evaluation accuracy. Therefore, this research developed a fuzzy assessment and improvement decision-making framework to determine IC components that require enhancement. This could assist outsourced IC wire bonding manufacturers in improving their processes to achieve better bonding quality and overall IC components quality, the aim of which is to reduce both the average number of failures and total expected losses.

 
Keywords IC component; Failure time interval; Exponential distribution; Operational performance indices of IC components; Fuzzy testing
   
    Article #:  RQD2026-1
 

Proceedings of 31st ISSAT International Conference on Reliability & Quality in Design
August 5-7, 2026