Application of SPC and AHP in Quality Control: Case of Electronic Components at a Manufacturing Company  
Author Khac-Hieu Nguyen

 

Co-Author(s) Anh-Van Nguyen;  My-Hanh Nguyen

 

Abstract Quality control is essential in electronic component manufacturing, where defect prevention directly impacts production efficiency. People widely use Statistical Process Control (SPC) to monitor and improve quality, but it fails to prioritize the most critical defect causes. This study integrated SPC with the Analytic Hierarchy Process (AHP) to improve defect identification and root cause analysis. The authors conducted a case study in an electronic components manufacturing company, concentrating on the welding process. The Pareto chart identified damaged cores as the most frequent defect. We analyzed potential causes using the 4M method and applied AHP to rank them based on expert evaluations. The results indicated inappropriate installation and excessive force testing parameters were the primary contributors. The study implemented a corrective solution by adjusting the settings of the force testing machine, which reduced the applied force while maintaining the quality of the product. Post-adjustment data confirmed the effectiveness of this approach. This study demonstrates that combining SPC and AHP enhances quality control decision-making, supporting continuous improvement in Industry 4.0 manufacturing.

 

Keywords SPC, AHP, quality control, defect analysis, manufacturing, Industry 4.0
   
    Article #:  RQD2025-81
 

Proceedings of 30th ISSAT International Conference on Reliability & Quality in Design
August 6-8, 2025